20.04.2026 | Next Level: The new generation of DOSOMAT filling machines!

Move to the next level: Visit us at interpack (Hall 6 – Stand E57) and discover our innovation in filling and sealing.

The demands placed on modern production lines are constantly growing: maximum flexibility must meet the highest standards of hygiene and process reliability. At interpack in Düsseldorf, we will demonstrate how we make this complexity manageable. 

 In Hall 6 – Stand E57 we will be presenting how DOSMAT packaging solutions tackles the challenges of the filling and sealing process with an innovation. Take the opportunity for an in-depth technical discussion with our experts on site. Together, we will find the optimal solution for your individual production requirements. 

Are you unable to attend interpack, or would you like to stay informed about our latest developments even after the trade fair? With our newsletter, you will receive regular insights into innovations, applications and events relating to Waldner and DOSOMAT packaging solutions. 

Register now! 

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